Home » Microsemi’s New Packaging Technology Enables Miniaturized Implantable Medical Devices
Microsemi’s New Packaging Technology Enables Miniaturized Implantable Medical Devices
August 21, 2012
Microsemi announced a new die packaging technology has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards.
EE Times
EE Times
Upcoming Events
-
21Oct